When: Tuesday, October 22, 2024 

What: A one-day meeting for potential applicants to the CHIPS NAPMP Advanced Packaging Research and Development funding opportunity. 

Where: Both in-person and virtually. In-person location: Hilton Washington DC Rockville Hotel & Executive Meeting Center, 1750 Rockville Pike, Rockville, MD 20852.

Who should attend 

On July,19, 2024, CHIPS R&D released a Notice of Intent (NOI) to invest up to $1.55 billion for funding across the five research and development areas (RDAs) outlined in the NAPMP vision paper. CHIPS R&D expects to issue a Notice of Funding Opportunity (NOFO) to solicit proposals for activities that will establish and accelerate domestic advanced packaging through investments in five RDAs: (1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA). 

Purpose: 

The Proposer’s Day is intended to familiarize potential applicants with the objectives and structure of the NAPMP Advanced Packaging Research and Development Notice of Intent (NOI), published on July 19, 2024. It will bring potential applicants together in a collaborative atmosphere to network and support partnerships among the community. 

Location: 

The NAPMP Proposer’s Day will be held as a hybrid meeting. The in-person portion will be held at the Hilton Washington DC/Rockville Executive Meeting Center in Rockville, MD. For those attending virtually, a link will be sent to all virtual attendees prior to the start of the meeting. 

Audience: 

For industry representatives, technical experts, researchers, and semiconductor industry alliances. CHIPS R&D expects eligible lead applicants and subrecipients will include for-profit organizations; non-profit organizations; accredited institutions of higher education, including community and technical colleges and minority serving institutions; and state, local, territorial, and Tribal government. It is expected that the NOFO will require that applicants must be domestic entities, meaning entities incorporated in the United States (including U.S. territories) with their principal place of business in the United States, including U.S. territories, and will potentially be subject to other eligibility requirements. 

Next Steps: 

For upcoming announcements and the opening of registration sites, follow the chips.gov web site.

We hope to see you in person, or virtually, at the Advanced Packaging Proposer’s Day, on October 22, 2024.