REGISTRATION NOW OPEN!

for the Advanced Packaging Summit. Co-hosted by the
CHIPS Research and Development Office
& NASA Ames Research Center.

Register Here

Advanced Packaging Summit

April 18-19, 2024

Key technical challenges and strategic approaches in advanced packaging in the semiconductor sector.

Location

In-person at the NASA Ames Conference Center (NACC) in Moffett Field, CA and virtually.

Audience

For industry representatives, technical experts, researchers, and semiconductor industry alliances. We welcome both domestic and international participation, as fostering global collaboration and enriching the discussions on advancing semiconductor standards and innovation are paramount to success.

Purpose

This event will bring together technical experts from industry, academia, government, and industry alliances to identify key technical challenges and strategic approaches in advanced packaging.

Next Steps

Register now for the Advanced Packaging Summit. In-person capacity is limited to 240 attendees total, including speakers. Registration will close at 5:00pm PDT/8:00pm EDT on Thursday, April 11. Late registrations will not be accepted. We hope to see you in person, or virtually, at the NASA Ames Conference Center on April 18-19, 2024, for the Advanced Packaging Summit!

Note to Foreign National registrants (both in-person and virtual): In preparation for your attendance to the CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Summit, you will receive a NASA Identity Invitation email and a Pass Phrase email. Please be responsive to upload your identification information to the secure system. Registration for the summit near the deadline might not allow sufficient time to process your attendance request.