Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon
On January 7, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities. HSC is the only U.S.-owned manufacturer of hyper-pure polysilicon and is one of just five companies in the world producing polysilicon to the purity level needed to serve the leading-edge semiconductor market. This award will support the construction of a new manufacturing facility in Hemlock, Michigan and is expected to create approximately 180 manufacturing jobs and over 1,000 construction jobs over time. The award follows the previously signed preliminary memorandum of terms, announced on October 21, 2024, and the completion of the Department’s due diligence. The Department will distribute the funds based on HSC’s completion of project milestones.
What They Are Saying
Here’s what they are saying about this historic announcement:
U.S. Secretary of Commerce Gina Raimondo: "CHIPS for America's investment in HSC will help advance supply chain security by ensuring the U.S. has a reliable, domestic supply of polysilicon – the bedrock of semiconductors. Establishing a domestic source of these materials is important for development of leading-edge chip applications, which helps bolster our economic and national security. Through targeted investments like this, the Biden-Harris Administration is driving technological innovation in industries of the future and creating jobs across the country.” [Statement]
National Economic Advisor Lael Brainard: “Nearly every single semiconductor made in America relies on the kind of advanced polysilicon that this investment will enable Hemlock to produce. Today’s announcement not only secures this key material needed for a resilient domestic semiconductor supply chain, but it will also further bolster Michigan as a manufacturing powerhouse.” [Statement]
Industry Voices
HSC Chairman and CEO AB Ghosh: "We are pleased to announce the signing of a direct funding agreement with the Department of Commerce under the CHIPS Act. This agreement is a key milestone in enhancing our manufacturing capabilities as we continue to serve the leading-edge semiconductor market with high quality and sustainably made polysilicon. The new facility will play a crucial role in strengthening the semiconductor supply chain in the United States. The support from the Department of Commerce and our dedicated partners at all levels of government has been instrumental in making this possible. We look forward to contributing to the revitalization of the domestic supply chain, creating good-paying jobs and driving technological leadership in the semiconductor industry." [Statement]
Semiconductor Industry Association: “Ultra-purity polysilicon is essential for the fabrication of the advanced semiconductors underpinning America’s economic strength, national security, and leadership in AI, autonomous driving, telecommunications, and many other critical technologies. The production of this material is the first step in the semiconductor production process, and it is critical for the U.S. to have domestic capabilities in this area. The incentives announced today will complement HSC’s investments in the domestic production of high-purity polysilicon and help reinforce America’s technology leadership and supply chain resilience. We commend HSC for investing in the United States and applaud the U.S. Department of Commerce for working to allocate critical CHIPS incentives.” [Statement]
Members of Congress
United States Senator Gary Peters (D-MI): “Michigan workers are the best in the world. We know how to make things well and with precision, and this major federal investment reflects that expertise. I’m thrilled that this funding I fought to secure is officially on its way to Hemlock Semiconductor to help expand its production of hyper-pure polysilicon and strengthen our domestic supply chains for critical semiconductor technologies, while creating thousands of good-paying jobs for people in our state.” [Statement]
United States Senator Elissa Slotkin (D-MI): “America’s self-reliance means bringing our critical supply chains back home from places like China. And semiconductor chips are absolutely critical to Michigan’s economic security and America’s national security. This award from the CHIPS Act will allow thousands of mid-Michigan workers to access the middle class, protect our auto industry, and strengthen our domestic supply chains,” [Statement]
United States Representative Kristen McDonald Rivet (D-08-MI) “This funding is a game changer for mid-Michigan. With it, we are making sure that Michigan will lead the world in manufacturing, and we are creating good-paying jobs for over one thousand hard-working families,” said Congresswoman McDonald Rivet. “Hemlock Semiconductor has reinforced their commitment to our community with an investment that will pay dividends for generations of Michigan workers. In Congress, I will continue fighting to protect American jobs and make sure that we manufacture more here in Michigan, not China.” [Statement]
United States Representative Haley Stevens (D-11-MI): “This is huge news for our great state! Michigan is leading the future of American competitiveness in semiconductor manufacturing thanks to @POTUS and the CHIPS and Science Act I helped write!!” [Post]
State and Local Officials
Governor Gretchen Whitmer: "Another big win in Michigan! Today’s game-changing investment into Hemlock Semiconductor will create more than 1,180 good-paying manufacturing and construction jobs and help our state continue to lead the future of the semiconductor industry," said Governor Whitmer. "Hemlock is a global leader and the only American-owned company that makes hyper-pure polysilicon, which is a crucial material in everything from phones to appliances to cars. By making it here in Michigan, we are bringing the supply chain home, saving manufacturers money, and creating cutting-edge opportunities for our workers. Let’s keep leading the future here in Michigan." [Statement]
Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility
On January 6, the Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third flagship CHIPS for America research and development (R&D) facility. The CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF), an NSTC and NAPMP facility, will feature cutting-edge capabilities to bridge the gap between laboratory research and full-scale semiconductor production. It will enable researchers and industry leaders to develop and test new materials, devices, and advanced packaging solutions in a state-of-the-art R&D environment. This newly constructed facility is expected to be operational in 2028 and will play a key role in driving U.S. leadership in semiconductor innovation, economic growth, and national security.
What They Are Saying
Here’s what they are saying about this historic announcement:
Biden-Harris Administration Leaders
U.S. Secretary of Commerce Gina Raimondo: “A strong research and development ecosystem is essential to ensuring the United States remains at the forefront of semiconductor innovation. Arizona has long been a hub for technological progress, and this new facility will strengthen our domestic supply chain, drive advanced manufacturing breakthroughs, and secure America’s leadership in this critical industry. Thanks to the bipartisan CHIPS and Science Act, combined with the other two CHIPS for America R&D flagship facilities, we will help bring American innovations to the global market, further securing our national and economic security.” [Statement]
White House Deputy Chief of Staff Natalie Quillian: “Thanks to the bipartisan CHIPS and Science act, we are investing at historic levels in the technologies of both today and tomorrow. Today’s announcement with ASU ensures the United States will continue to be a leader in research and development and win the future by investing in skilled workers, moonshot technologies, and the advancements needed to stay ahead in critical industries, such as AI.” [Statement]
Members of Congress
U.S. Senator Mark Kelly (AZ): “This groundbreaking effort will mean that researchers and startups won’t need to go to China or Europe to test out their cutting-edge prototype microchips—they’ll be able to do that right here in America. Creating this world-class prototyping and packaging facility was a priority of mine when negotiating the Chips and Science Act. The United States must lead the way in semiconductor research and development, and there’s nowhere more appropriate for it than Arizona. The most advanced microchips in the world that power everything from AI to quantum computing will now be able to be developed, tested, manufactured, and packaged in our state. I’m grateful for Arizona State University’s commitment to being at the forefront of microchip innovation, and to the years of partnership between Arizona’s elected leaders—Republicans and Democrats—our business community, and our economic development leaders to make this happen.” [Statement]
U.S. Senator Ruben Gallego (AZ): “Arizona continues to prove its role as not just a nationwide leader, but a global leader, in semiconductor research and development. With this announcement, our state will serve as a driver of innovation for the semiconductor ecosystem in the country while creating thousands of high-paying jobs for hardworking Arizonans. Today’s announcement is why I fought in Congress to get the Chips Act into law. Thank you to Arizona State University, our business leaders, and multiple administrations across the years for making this bipartisan achievement possible.” [Statement]
U.S. Congressman Greg Stanton (AZ-04): “Future-defining advancements in technology like AI wouldn’t be possible without advanced packaging. It’s a national security imperative that the U.S. out-innovate our global competitors. Thanks to our CHIPS Act, this new Advanced Packaging Piloting Facility at ASU will help develop the next-generation technology America needs to compete and win on the world stage–and train the future of the semiconductor workforce here at home.” [Statement]
U.S. Congressman Andy Biggs (AZ-05): “Arizona is the ideal choice to host the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility. With the fastest growing semiconductor ecosystem in the country, Arizona is ready to support the R&D, manufacturing, packaging, and workforce needs of the industry. It’s crucial that America continue to be a leader in semiconductor innovation and manufacturing, and Arizona is perfectly suited to be a part of that effort.” [Statement]
U.S. Congressman Raul Grijalva (AZ-07): “With this selection Arizona will remain a leader in the nation in developing next generation technology. It is my hope that with this critical investment we can demonstrate the ability to improve efficiency, streamline production, and reduce power consumption within semiconductor development.” [Statement]
U.S. Congressman Abe Hamadeh (AZ-08): “It's imperative that the United States maintain the capabilities to out-perform our competitors and adversaries. This state-of-the-art research facility will be a beacon of semiconductor innovation, attracting companies from around the world to Arizona to test and prototype leading-edge technologies. These efforts will help ensure America, not China or anywhere else, leads the critical breakthroughs of the future.” [Statement]
State and Local Officials
Governor Katie Hobbs: “Today’s announcement solidifies Arizona’s position as a global hub for advanced manufacturing and innovation. This flagship facility will serve as an anchor for Arizona’s thriving semiconductor ecosystem while supporting R&D and supply chain resiliency nationwide. This investment ensures the next generation of this critical, leading-edge technology is developed here in Arizona, while we support the workforce and jobs of the future. I’m grateful to Secretary Raimondo and the Commerce Department and our Arizona Congressional delegation for their support. I also want to recognize the hard work of the Arizona Commerce Authority, ASU, and all their partners to win this national laboratory for our state.” [Statement]
Mayor Kate Gallego, City of Phoenix: “Phoenix is proud to be home to the nation’s largest-ever foreign direct investment, Taiwan Semiconductor Manufacturing Company, which has sparked a wave of projects that are strengthening our local economy, driving innovation, and transforming lives across the region. The NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility coming to the Valley is proof that our growing semiconductor ecosystem is positioning us as leaders not just in the U.S., but globally—from manufacturing to packaging. We are thankful for our ongoing partnership with ASU, which in addition to housing this new facility, is helping us build a pipeline of talent that will bolster this industry for decades to come. We look forward to continuing our work alongside academia, business partners, and strong Arizona leaders such as Senator Kelly to ensure the project is a huge success.” [Statement]
Mayor Corey Woods, City of Tempe: “Tempe and Arizona continue to be at the center of groundbreaking research and development, leading the way in next-generation technology. We are proud to be the home of this new flagship facility that will serve as a hub for semiconductor innovation nationwide. We thank our partners at ACA and ASU, which have developed a world-class research ecosystem right in our backyard to serve our community and beyond.” [Statement]
Mayor Kevin Hartke, City of Chander: “Today’s announcement builds upon the CHIPS for America vision by leveraging the Valley’s advanced manufacturing ecosystem and expanding innovation in the areas of semiconductor research and development. Our region offers the infrastructure, resources and talent for companies contributing to America’s strength and leadership in this vital industry.” [Statement]
Mayor Jason Beck, City of Peoria: “The selection of Arizona as the home for the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility is a testament to our state’s importance in semiconductor innovation and advanced technology. Peoria is proud to play a vital role in this ecosystem through our partnership with Amkor on their forthcoming cutting-edge advanced packaging and test facility. This initiative not only strengthens our local economy but also continues to solidify our region’s position as a global leader in semiconductor manufacturing and innovation. We look forward to continuing our collaboration with regional and national partners to drive this critical industry forward.” [Statement]
Maricopa County Supervisor Mark Stewart, District 1: “The semiconductor industry is vital to onshoring critical technology that ensures the security and competitiveness of the United States. I applaud the collaboration between government, private organizations, and educational institutions in uniting local, state, and federal agencies to drive innovation, create jobs, and prepare a skilled workforce. Maricopa County is in full support of these efforts and excited to collaborate on this transformative initiative, building a brighter future for Arizona and strengthening America’s leadership in technology.” [Statement]
Maricopa County Supervisor and former Representative Debbie Lesko: “I am excited to see that Arizona was selected to host a major facility for advanced semiconductor chips packaging. This significant decision from the federal government proves yet again that our state has one of the most business-friendly environments in the nation. I look forward to seeing the economic benefits for Arizona when this facility opens, and I am grateful to have been a part of this bipartisan effort to bring another CHIPS R&D operation to the Grand Canyon State.” [Statement]
Organizations
Deirdre Hanford, Chief Executive Officer, Natcast: “The PPF will play a critical role in advancing semiconductor innovation across the country. This facility will be a premier destination where researchers from industry, academia, startups, and the broader semiconductor ecosystem will convene to explore, experiment, and collaborate on the next generation of semiconductor and packaging technologies that will power the industries of the future.” [Statement]
Sandra Watson, President and CEO, Arizona Commerce Authority: “This announcement is a testament to Arizona’s robust semiconductor ecosystem and national network of industry and research partners advancing technology innovation. We are incredibly grateful to Governor Hobbs, Senator Kelly, our Congressional delegation, the Arizona Legislature, the Commerce Department, Chips Office, Natcast, and all our industry partners for their leadership and collaboration. I especially want to recognize Dr. Michael Crow and his team at ASU for their steadfast partnership.” [Statement]
Danny Seiden, President and CEO, Arizona Chamber of Commerce and Industry: “Today’s announcement is a huge win for Arizona and represents the culmination of many years of work to establish the best business environment in the country. This facility will serve as a magnet for companies from all over the country looking to advance R&D and represents another landmark expansion for Arizona’s semiconductor industry. I want to credit Sandra Watson and the ACA, ASU, and all the partners who supported this project.” [Statement]
David Anderson, President of NY CREATES: “On behalf of NY CREATES, I would like to extend our congratulations to Arizona State University on being selected as the anticipated location for the CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility, an #NSTC and NAPMP facility. We welcome ASU as a critical peer supporting the NSTC’s mission, as NY CREATES hosts the CHIPS for America #EUV Accelerator, a flagship NSTC facility at our Albany NanoTech Complex, North America’s most advanced non-profit semiconductor R&D center.” [Statement]
Industry
Joe Stockunas, President, SEMI Americas: “SEMI applauds the U.S. Department of Commerce and Natcast.org for selecting ASU as one of the flagship R&D locations to facilitate academic and industry collaboration for 300mm front-end semiconductor manufacturing and advanced packaging. Arizona’s commitment to expanding semiconductor manufacturing and advance chip innovations has been bolstered by recent CHIPS Act investments, and having this facility as part of the growing local ecosystem is a natural fit.” [Statement]
John Neuffer, President and CEO, SIA: “Today’s announcement is a welcome step forward for U.S. leadership in semiconductor innovation, marking significant progress in the implementation of the critical R&D programs enacted in the bipartisan CHIPS and Science Act. The new Arizona facility will benefit from – and build upon – the state’s already-strong semiconductor fabrication and advanced packaging ecosystem. For America to remain the world’s technology leader, it must continue to lead in semiconductor innovation. Driving forward U.S. research in chip prototyping and advanced packaging is critical to keeping America on top in chip technology. We look forward to continuing to work with leaders in Washington to ensure the CHIPS and Science Act’s R&D initiatives and manufacturing incentives remain on track to deliver big benefits for America’s economic strength, national security, and global competitiveness.” [Statement]
Rose Castanares, President, TSMC Arizona: “This announcement is tremendous news for our industry as we begin a new year. Natcast’s decision to locate the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona is one that will have wide-ranging positive benefits well beyond 2025. Arizona’s semiconductor footprint is rapidly expanding, and its leadership in both cutting-edge manufacturing and advanced packaging provides a one-of-a-kind opportunity to accelerate research and innovation. With our historic $65 billion investment, TSMC Arizona is deeply committed to our US operation, and we look forward to collaborating with industry peers, research leaders and Natcast on its advanced packaging priorities.” [Statement]
Sanjay Natarajan, Sr. Vice President, Intel Corporation: “Intel applauds the U.S. Department of Commerce and Natcast’s decision to establish the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona. Building on our 45-year legacy of innovation and investment in the state, Intel will actively collaborate with industry and research leaders at this facility to drive breakthrough advances in leading edge semiconductor and packaging technologies. We plan to provide our expertise and resources to accelerate innovation, strengthen supply chain resilience, and enhance U.S. competitiveness. Intel will play a vital role in ensuring the long-term success of this historic research initiative through direct engagement and strategic support.” [Statement]
Kevin Engel, Executive Vice President of Business Units, Amkor Technology: “This facility promises to accelerate innovation that will advance U.S. competitiveness and supply chain resilience, and at Amkor, we look forward to supporting its long-term success.” [Statement]
Hichem M'Saad, CEO and Chair of the Management Board, ASM: “We commend the choice to establish the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona, a state at the forefront of a thriving semiconductor industry. This marks an exciting era for the industry and for ASM, as we celebrate nearly five decades of driving groundbreaking chip innovation in Arizona. This development is a pivotal moment in advancing collaborative research and innovation in advanced packaging, and we eagerly anticipate its lasting success.” [Statement]
Dr. Prabu Raja, President of the Semiconductor Products Group, Applied Materials: “Congratulations to the State of Arizona for being selected as the home of the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility. Applied Materials has a long and successful history of collaborating with industry and research partners in Arizona, and we are pleased to participate in the growth of the region in support of U.S. leadership in semiconductors.” [Statement]
Thomas Sonderman, CEO, SkyWater: “SkyWater is pioneering advancements for next-generation packaging, providing a historic opportunity for collaboration with industry and research leaders. We look forward to this partnership, ensuring we deliver the best ROI possible for this critical investment, while supporting its long-term success.” [Statement]
Rama Puligadda, Chief Technical Officer, Brewer Science: “We applaud the decision to locate the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona. Brewer Science continues to pioneer next-generation materials needed for chip innovation, we look forward to partnering on this important research effort for our industry and supporting its long-term success.” [Statement]
Steve Sanghi, CEO, President and Chair of the board, Microchip Technology Inc.: “Arizona is home to a vibrant and rapidly expanding semiconductor ecosystem and is uniquely positioned to host this facility. We applaud the decision to locate the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona and look forward to its long-term success.” [Statement]
Tim Olson, CEO, Deca Technologies: “This once in a generation investment will boost the entire semiconductor industry with powerful capabilities to further develop and scale new technologies. Deca and ASU have already established a broad-ranging cooperation centered on advanced packaging. With the new pilot facility investment in Arizona, we’ll no doubt see an influx of private-sector investments and collaborations, new partnerships and exciting new ideas that will accelerate America’s efforts to regain preeminence in the highly competitive global semiconductor industry.” [Statement]
Academia
Arizona State University President Dr. Michael Crow: “This is the largest of three CHIPS R&D flagship facilities being launched that together represent the greatest national laboratory investments since those that came out of the Manhattan Project. The CHIPS R&D project will create a national lab that will be the final piece in a semiconductor ecosystem that serves the nation with research and development, manufacturing and workforce development all right here in Arizona. You’ll have all three things together in the same place to help the nation; Arizona will be the hub nationally – and ASU is at the center of the hub.” [Statement]
Purdue University President Mung Chiang: “On behalf of Purdue University, I am pleased to express our strong support for the new NSTC/NAPMP R&D facility that will further enhance America's resurgence in semiconductor manufacturing across the country. The success of the CHIPS and Science Act in creating jobs, workforce and innovation will require a whole of nation approach. As the workforce-research center of a new, rapidly emerging semiconductor industry ecosystem in the Silicon Heartland with leading companies such as SK hynix, Purdue looks forward to building on our collaborations with ASU colleagues in this particular proposal to execute for its successful implementation in the coming years.” [Statement]
University of Central Florida President Alexander N. Cartwright: “Arizona State University and the University of Central Florida have long been leaders in innovation and collaboration to solve the world‘s hardest problems. UCF is pleased to support ASU, the U.S. Department of Commerce, and Natcast’s efforts to invent the future of semiconductors and train the next generation of talent right here in the United States.” [Statement]
University of California President Michael V. Drake: “The University of California applauds the selection of Arizona to host the CHIPS for America prototyping and packaging center, which will complement the CHIPS for America design and collaboration facility in Sunnyvale, California, previously announced in November. In partnership with Arizona State University, the University of California system is ready to get to work designing, prototyping, and packaging the next generation of semiconductors, while also training engineers to maintain U.S. semiconductor leadership through the 21st century and beyond.” [Statement]
FUNDING OPPORTUNITY - CLOSING MONDAY: CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA)
On October 30, 2024, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI) and autonomous experimentation (AE) technologies to support the long-term viability of next-generation semiconductor manufacturing. The CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) funding opportunity will be critical in meeting the industry’s technology, economic, and sustainability goals.
On November 15th, the CHIPS Research and Development Office hosted a hybrid Proposer’s Day event to bring potential applicants together in a collaborative atmosphere to network and support partnerships among the community. The event recording and presentation are available on CHIPS.gov.
Mandatory concept papers are due January 13, 2025.
CHIPS for America End of the Year Overview
CHIPS for America has released our End of Year report highlighting the program’s achievements over the last year as we’ve advanced American economic and national security and protected taxpayer funds.
From more than $33 billion in manufacturing awards, to having all five leading-edge logic and DRAM companies expanding on American soil while no other economy has more than two, to more than $7 billion in R&D funds announced and 100 NSTC members signed or committed.
Learn more about CHIPS for America’s successes and accomplishments.
CHIPS Program Office - Vision for Success Two Year Report
The CHIPS for America Program has spurred a once-in-a-generation transformation, catalyzing historic investments that have reshaped the trajectory of semiconductor manufacturing in the United States.
These investments have positioned the United States to lead in an industry foundational to our national security and to every element of modern life. Read more about how the CHIPS Program Office has met the goals laid out in our Vision for Success.
Learn more about how the CHIPS Program Office has met the goals laid out in our Vision for Success on CHIPS.gov
CHIPS for America in the News
Phoenix Business Journal: Arizona, ASU score CHIPS for America flagship semiconductor facility
New facility will put Arizona at forefront of new computer chip packaging capabilities
[Amy Edelen, 1/6/25]
Arizona's semiconductor industry just got another boost.
The U.S. Department of Commerce and Natcast announced Monday that Arizona will be home to the country's third flagship CHIPS for America research and development facility, underscoring the state’s growing role in the national semiconductor industry.
The NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility will operate at 8240 S. River Parkway in Arizona State University’s Research Park in Tempe.
Natcast is the operator of the National Semiconductor Technology Center, a public-private consortium dedicated to semiconductor research and development in the U.S.
“This facility will be a premier destination where researchers from industry, academia, startups, and the broader semiconductor ecosystem will convene to explore, experiment, and collaborate on the next generation of semiconductor and packaging technologies that will power the industries of the future,” Deirdre Hanford, Natcast CEO, said in a statement.
Mid Michigan Now: U.S. Department of Commerce awards Hemlock Semiconductor $325M
[1/7/24]
HEMLOCK, MICH.— Hemlock Semiconductor (HSC) is receiving $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
The Biden-Harris Administration says the U.S. Department of Commerce awarded the money.
HSC is the only U.S.-owned manufacturer of hyper-pure polysilicon and is one of just five companies in the world producing polysilicon to the purity level needed to serve the leading-edge semiconductor market.
This award will support the construction of a new manufacturing facility in Hemlock, Michigan and is expected to create approximately 180 manufacturing jobs and over 1,000 construction jobs over time. The award follows the previously signed preliminary memorandum of terms, announced on October 21, 2024, and the completion of the Department’s due diligence. The Department will distribute the funds based on HSC’s completion of project milestones.
About CHIPS for America
CHIPS for America is part of President Biden’s economic plan to invest in America, stimulate private sector investment, create good-paying jobs, make more in the United States, and revitalize communities left behind. CHIPS for America includes the CHIPS Program Office, responsible for manufacturing incentives, and the CHIPS Research and Development (R&D) Office, responsible for R&D programs. Both offices sit within the National Institute of Standards and Technology (NIST) at the Department of Commerce. NIST promotes U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that enhance economic security and improve our quality of life. NIST is uniquely positioned to successfully administer the CHIPS for America program because of the bureau’s strong relationships with U.S. industries, its deep understanding of the semiconductor ecosystem, and its reputation as fair and trusted. Visit https://www.chips.gov to learn more.
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