CHIPS for America Announces Incentive Awards in Arizona, Indiana, Missouri, Texas, and Utah
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor to Bring End-to-End Chip Production to the U.S.
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with Samsung to Solidify U.S. Leadership in Leading-Edge Semiconductor Production
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix to Advance U.S. Technological Leadership and Expand Capacity of Chips Crucial to the AI Supply Chain
On December 19, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers
On December 17, the Biden-Harris Administration announced that the U.S. Department of Commerce issued direct funding awards to GlobalWafers America, LLC (GWA) and MEMC LLC (MEMC), subsidiaries of GlobalWafers Co., Ltd. (GlobalWafers), of up to $406 million under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
CLOSING TODAY: CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Funding Opportunity
On October 18th, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) funded by the CHIPS and Science Act to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor technologies.
CHIPS for America anticipates making available up to approximately $1.6 billion for funding multiple awards across five research and development (R&D) areas, with the potential for follow-on funding for prototyping activities.
The five R&D areas are:
- Equipment, Tools, Processes, and Process Integration
- Power Delivery and Thermal Management
- Connector Technology, Including Photonics and Radio Frequency (RF)
- Chiplets Ecosystem
- Co-design/Electronic Design Automation (EDA)
Mandatory concept papers are due December 20, 2024.
FUNDING OPPORTUNITY:CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA)
On October 30, 2024, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI) and autonomous experimentation (AE) technologies to support the long-term viability of next-generation semiconductor manufacturing. The CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) funding opportunity will be critical in meeting the industry’s technology, economic, and sustainability goals.
On November 15th, the CHIPS Research and Development Office hosted a hybrid Proposer’s Day event to bring potential applicants together in a collaborative atmosphere to network and support partnerships among the community. The event recording and presentation are available on CHIPS.gov.
Mandatory concept papers are due January 13, 2025.
CHIPS for America in the News
Reuters: US finalizes up to $6.75 billion in chips awards for Samsung, Texas Instruments, Amkor
[Dave Shepardson, 12/20/24]
The U.S. Commerce Department said on Friday it was finalizing an award of up to $4.745 billion to South Korea's Samsung Electronics and up to $1.61 billion for Texas Instruments to expand chips production.
The department also finalized an award of up to $407 million to help fund Amkor Technology planned $2 billion advanced semiconductor packaging facility in Arizona, which is set to be the largest of its kind in the U.S.
The Samsung award is about $1.7 billion smaller than the preliminary award announced in April of up to $6.4 billion and reflects its revised smaller investment plans, the department said.
St. Louis Business Journal: Manufacturer gets millions in federal funds to expand semiconductor wafer production
[Jacob Kirn, 12/17/24]
The federal government on Tuesday said it has issued millions of dollars in subsidies to a firm to expand silicon wafer production at a St. Charles County facility.
The U.S. Department of Commerce's intent to give the up to $406 million to GlobalWafers, under the $280 billion CHIPS and Science Act of 2022, was previously reported in July.
Taiwan-based GlobalWafers Co. Ltd. plans to use the funds to expand manufacturing sites in O'Fallon, Missouri, and in Sherman, Texas. The funding will go toward the company's planned $4 billion in capital expenditures to construct new wafer-making facilities at its MEMC LLC subsidiary in O'Fallon and its GlobalWafers America LLC unit in Texas, officials said.
Indianapolis Business Journal: Feds finalize deal to give SK hynix $458M for West Lafayette facility
[Cate Charrron, 12/19/24]
WEST LAFAYETTE, Indiana - Federal officials confirmed early Thursday that South Korean chip manufacturer SK Hynix Inc. will receive up to $458 million in federal CHIPS Act funding to build its $3.87 billion semiconductor packaging facility at the Purdue Research Park in West Lafayette.
In August, the U.S. Department of Commerce and SK Hynix signed a non-binding preliminary memorandum of terms that laid the groundwork for a grant of up to up to $450 million. Thursday morning’s announcement is the result of a federal review of the project.
“With this investment in SK Hynix—the world’s leading producer of high-bandwidth memory chips—and their partnership with Purdue University, we are solidifying America’s AI hardware supply chain in a way no other country on Earth can match, creating hundreds of jobs in Indiana, and ensuring the Hoosier State plays an important role in advancing U.S. economic and national security, ” U.S. Secretary of Commerce Gina Raimondo said in written remarks.
The chip manufacturer announced plans in April to open a 430,000-square-foot building spanning 90 acres in the second half of 2028. Total employment at the site is expected to reach more than 1,000 by 2030.
Data Center Dynamics: SK hynix secures $458m in CHIPS Act funding
[Charlotte Trueman, 12/19/24]
The US Department of Commerce has awarded SK Hynix $458 million in direct funding under the CHIPS and Science Act.
The funding is a slight increase on the $450 million that the government proposed to award the memory chip maker in April 2024.
In a statement, the department said the funding would support the $3.87 billion investment SK Hynix has pledged to make in West Lafayette, Indiana, to establish a high-bandwidth memory (HBM) advanced packaging fabrication and research and development (R&D) facility.
Mass production at the plant is expected in the second half of 2028 and the Department of Commerce said the funding will be dispersed based on the company's completion of project milestones.
In addition to producing next-generation HBM, the site will also function as an R&D facility for AI products, with SK Hynix planning to collaborate with Purdue University and Ivy Tech Community College to develop training programs and a new curriculum to help cultivate a talent pipeline in the region.
About CHIPS for America
CHIPS for America is part of President Biden’s economic plan to invest in America, stimulate private sector investment, create good-paying jobs, make more in the United States, and revitalize communities left behind. CHIPS for America includes the CHIPS Program Office, responsible for manufacturing incentives, and the CHIPS Research and Development (R&D) Office, responsible for R&D programs. Both offices sit within the National Institute of Standards and Technology (NIST) at the Department of Commerce. NIST promotes U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that enhance economic security and improve our quality of life. NIST is uniquely positioned to successfully administer the CHIPS for America program because of the bureau’s strong relationships with U.S. industries, its deep understanding of the semiconductor ecosystem, and its reputation as fair and trusted. Visit https://www.chips.gov to learn more.
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