Biden-Harris Administration Announces Preliminary Terms with HP to Development and Commercialization of Cutting-Edge Semiconductor Technologies
On Tuesday, the Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from R&D activities to commercial manufacturing operations. Through this proposed investment, the Biden-Harris Administration would enhance U.S. technological leadership by driving innovation of groundbreaking semiconductor technologies that serve important end markets, notably including life sciences instrumentation and technology hardware used in artificial intelligence applications.
UPDATE: CHIPS R&D Facility Selection Process
On July 12, 2024, as part of the Biden-Harris Administration’s effort to advance U.S. technological leadership in microelectronics, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the processes for selecting the first three research and development (R&D) facilities funded through the CHIPS and Science Act.
The facilities include an NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility, an NSTC Administrative and Design Facility, and an NSTC Extreme Ultraviolet (EUV) Center, as described here in the Facilities Model Factsheet. The Department and Natcast are pursuing three separate site selection processes – one for each facility – given the varying timelines and technical specifications of each. The specific processes are outlined in the facilities Process Factsheet as described here.
The Department and Natcast appreciate the interest expressed in these facilities. An initial universe of locations that meet the specifications, as described in the Factsheets, have been identified as potential options for each of these facilities. These locations have been notified and are moving through the next stages of review.
The Department and Natcast expect to issue a further update on the CHIPS R&D facilities later this fall. The selection process for the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility began on July 16, when the Department and Natcast issued an “Ecosystem Questionnaire for States and Territories to Inform CHIPS R&D Facility Site Selection Process” (Ecosystem Questionnaire) to the Economic Development Organizations (EDOs) of all 56 states, territories, and the District of Columbia. The Ecosystem Questionnaire was developed to identify thriving and vibrant semiconductor ecosystems that could potentially support the facility.
The selection process for the NSTC Administrative and Design Facility and NSTC EUV Center began the same week; final selections for all three facilities will be made based on a determination of the sites that are most advantageous to the objectives of CHIPS for America.
CHIPS for America Announces New CHIPS Metrology Community of Practice
This week, CHIPS for America announced the establishment of a new community of practice, the CHIPS Metrology Community. The Community will facilitate data and knowledge sharing across initiatives within the CHIPS Metrology seven Grand Challenges and help stakeholders inform the industry standards that are critical for enhancing U.S. economic and national security competitiveness.
Participation in the Community is open and available to members across the semiconductor industry, academia, consortia, and all stages of career levels, from engineers to executives.
On Wednesday, September 18, the CHIPS for America R&D Office will host a hybrid Workshop on Accelerating R&D for Sustainable Semiconductor Materials focused on increasing sustainability in semiconductor manufacturing materials. The workshop will include opening remarks from Under Secretary Locascio, Director of NIST and the Under Secretary of Commerce for Standards and Technology, and Arati Prabhakar, Director of the White House Office of Science and Technology Policy (OSTP) and Assistant to the President for Science and Technology. Their remarks will be followed by a moderated discussion with experts on sustainability opportunities, a listening session from Natcast that focuses on a sub-set of possible topics related to PFAS research, and breakout sessions on sustainable semiconductor materials discovery and deployment via artificial intelligence-powered autonomous experimentation (AI/AE). On Thursday, September 19, there will also be limited virtual one-on-one meetings with CHIPS staff.
When: Wednesday, September 18, 2024
Where: Hybrid, with limited in-person participation in Washington, DC
Registration Details: Coming soon!
CHIPS Metrology Project Updates
The CHIPS Metrology Program continues to build partnerships between researchers and industry to address the microelectronics industry’s grand challenges. This month, the program kicked off 14 new projects. In total, CHIPS for America has funded over $190 million across over 40 projects that are helping to develop new instruments, methods, data analysis, and models and simulations. More projects will be announced in the coming months.
Projects launched by the CHIPS Metrology Program can be found here. The page will continue to be updated with additional projects.
NSTC Proposers’ Day: Test Vehicle Innovation Pipeline
On September 10, 2024, Natcast will host a Proposer’s Day for the National Semiconductor Technology Center’s (NSTC) second initial R&D topic: the Test Vehicle Innovation Pipeline (TVIP) program. The Proposers’ Day event will introduce the TVIP program and provide information and timelines for potential applicants. Natcast will provide an overview of the program goals, address questions, and provide opportunities for networking and teaming among attendees.
When: Tuesday, September 10, 2024
Where: Hybrid virtual and in-person at the Westin Tysons Corner, Falls Church, VA
About TVIP: The NSTC’s TVIP program will address the challenges in transitioning basic scientific discoveries from research into development. The TVIP program will provide a new family of test vehicles for semiconductor research which will be available to NSTC members.
The Call for Proposals (CFP) was released on August 28, 2024. The anticipated total program award funding is up to $55 million with 4-12 awards anticipated. Individual awards are expected to range from $1 million to $20 million.
In-person Registration Deadline: Wednesday, September 4, 2024, at 5:00 PM ET.
Webcast (Virtual) Registration Deadline: Monday, September 9, 2024, at 12:00 PM ET
CHIPS for America in the News:
HP Inc. has landed up to $50 million in federal CHIPS Act money to modernize its campus in Corvallis, aiming to more tightly integrate its research and manufacturing on the site. The company says it expects to add 100 factory jobs in Corvallis and expects the project will temporarily employ 150 construction workers. HP indicated the project might eventually make way for a larger production line in Corvallis.
The Biden Administration announced that HP and the Department of Commerce have signed a preliminary agreement that will grant the tech company $50 million under the CHIPS and Science Act. HP officials said the money will help them expand their Corvallis facility, which means new projects and more jobs. Oregon Governor Tina Kotek said she is excited about what this means for the state and the Willamette Valley.
More federal CHIPS Act money is set to flow to Oregon, with HP Inc. awarded $50 million to support expansion and modernization of its facilities in Corvallis. The Biden administration announced the preliminary grant early Tuesday, touting the work HP (NYSE: HPQ) does in Corvallis on semiconductor-related technologies with bioscience and ultimately health applications. A ceremonial announcement with Commerce Department officials was planned for later Tuesday morning at HP.
The funding would support projects that could create 100 construction jobs and 250 manufacturing jobs
Technology company HP Inc. is set to receive as much as $50 million to expand its Corvallis facilities as part of an overall effort to support semiconductor development in the U.S., the federal government announced today. The potential funding is part of the federal CHIPS and Science Act which aims to attract advanced computer chip manufacturing back to the U.S.
About CHIPS for America
CHIPS for America is part of President Biden’s economic plan to invest in America, stimulate private sector investment, create good-paying jobs, make more in the United States, and revitalize communities left behind. CHIPS for America includes the CHIPS Program Office, responsible for manufacturing incentives, and the CHIPS Research and Development (R&D) Office, responsible for R&D programs. Both offices sit within the National Institute of Standards and Technology (NIST) at the Department of Commerce. NIST promotes U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that enhance economic security and improve our quality of life. NIST is uniquely positioned to successfully administer the CHIPS for America program because of the bureau’s strong relationships with U.S. industries, its deep understanding of the semiconductor ecosystem, and its reputation as fair and trusted. Visit https://www.chips.gov to learn more.
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