Biden-Harris Administration Announces Preliminary Terms with GlobalWafers to Significantly Increase Production of Silicon Wafers in U.S.
On Wednesday, July 17, as part of the Investing in America tour, the Biden-Harris Administration announced that the U.S. Department of Commerce and GlobalWafers America, LLC and MEMC LLC (“MEMC”), subsidiaries of GlobalWafers Co., Ltd. (“GlobalWafers”), have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $400 million in proposed direct funding under the CHIPS and Science Act to help onshore critical semiconductor wafer production and advance U.S. technology leadership. President Biden signed the bipartisan CHIPS and Science Act, a key component of his Investing in America agenda, to usher in a new era of semiconductor manufacturing in the United States, bringing with it a revitalized domestic supply chain, good-paying jobs, and investments in the industries of the future. The proposed CHIPS investment would support the construction of new wafer manufacturing facilities and the creation of 1,700 construction jobs and 880 manufacturing jobs. This proposed investment will support projects with total capital expenditures of approximately $4 billion across both states.
“President Biden is restoring our leadership in the entire semiconductor supply chain – from materials to manufacturing, to R&D. With this proposed investment, GlobalWafers will play a crucial role in bolstering America’s semiconductor supply chain by providing a domestic source of silicon wafers that are the backbone of advanced chips,” said U.S. Secretary of Commerce Gina Raimondo. “As a result of this proposed investment, the Biden-Harris Administration is helping to secure our supply chains, which will create over 2,000 jobs across Texas and Missouri and ultimately lowering costs and improving economic and national security for Americans.”
CHIPS for America Highlights CHIPS Regional Strategy
Regions across the United States are already hosting investments of vital importance to the CHIPS for America Vision for Success and the country’s economic and national security over the next decade, and more are on the way in new regions. As part of the Biden-Harris Administration’s broader place-based economic development agenda, CHIPS for America is working with key regions across the United States to provide the support needed for expanding and emerging regional semiconductor industry clusters to succeed. CHIPS for America is initially focusing these efforts in locations hosting commercial-scale manufacturing of leading-edge logic or leading-edge memory technology – building on a key objective of CHIPS’ Vision for Success. These regions are Arizona, Idaho, New York, Ohio, Oregon and Texas.
CHIPS Regional Strategy supports the Biden-Harris Administration’s Investing in America (IIA) agenda in catalyzing place-based economic growth and emphasizing that America’s economy is stronger when we invest in communities rather than leave them behind. CHIPS is integrating its regional strategy with existing IIA programs and initiatives, including EDA’s Tech Hubs Programs, which were also created by the CHIPS and Science Act, as well as White House Workforce Hubs, which are driving effective place-based workforce development efforts to train and connect Americans to the good-paying jobs created through the Investing in America agenda, and playing a key part in attracting follow-on industry investment.
Dr. Dev Palmer Joins the CHIPS for America Research and Development Office
This week, the Department of Commerce announced that Dr. Dev Palmer has joined CHIPS for America’s Research and Development (R&D) Office as the director of the National Advanced Packaging Manufacturing Program (NAPMP). As Director of the NAPMP, Dr. Palmer will help advanced the programs mission to establish a vibrant, self-sustaining, profitable, onshore packaging industry where advanced node chips manufactured in the U.S. are packaged in the U.S.
Dr. Palmer is joining CHIPS for America from the Defense Advanced Research Projects Agency (DARPA). where he most recently served Managing Director, Next-Generation Microelectronics Manufacturing at the DARPA Microsystems Technology Office. During his time with the agency, he also served the deputy director of the Microsystems Technology Office where he worked closely with the Office Director to set strategy, guide the development of new programs and execution of existing programs, and identify and recruit new Program Managers.
U.S. Department of Commerce Invites Three Teams to Submit Applications for the CHIPS Manufacturing USA Institute
Today, the U.S. Department of Commerce announced that three teams have been invited to submit full applications for the CHIPS Manufacturing USA funding opportunity to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry. Digital twins are virtual models that mimic the structure, context, and behavior of a physical counterpart. Once established, the CHIPS Manufacturing USA institute will help unite the semiconductor industry to unlock the enormous potential of digital twin technology for breakthrough discoveries. The CHIPS Manufacturing USA institute is the first Manufacturing USA institute launched by the Department of Commerce under the Biden Administration.
Unlike traditional, physical research models, digital twins can exist in the cloud, which enables collaborative design and process development by engineers and researchers across the country, creating new opportunities for participation, speeding innovation, and reducing costs of research and development. Digital twin-based research can also leverage emerging technology like artificial intelligence to help accelerate the design of new U.S. chip development and manufacturing concepts and significantly reduce costs by improving capacity planning, production optimization, facility upgrades, and real-time process adjustments.
The CHIPS for America Program anticipates awarding up to approximately $285 million for a first-of-its kind institute focused on the development, validation, and use of digital twins for semiconductor manufacturing, advanced packaging, assembly, and test processes. Full applications are due on September 9, 2024.
The CHIPS Manufacturing USA institute will join an existing network of seventeen Manufacturing USA institutes designed to secure the future of U.S. manufacturing through innovation, education, and collaboration.
CHIPS for America Due Diligence Process Fact Sheet
On Monday, the CHIPS Program Office released a Due Diligence Process Fact Sheet outlining the due diligence phase of the CHIPS Program Office’s investment process as part of the Commercial Fabrication Facilities Notice of Funding Opportunity.
The purpose of due diligence is for the Department to validate material facts of the application, address critical risks identified in the previous merit review, and uncover any new information that may impact the size, nature, or timing of the proposed award. The outcome of the due diligence process will determine if the CHIPS Program Office will advance the applicant to an award.
SUMMARY REPORT: CHIPS R&D Program Standards Summit
CHIPS R&D has developed a comprehensive standards roadmap that responds to calls from the private sector for semiconductor standards efforts, the requirements of CHIPS legislation, and the provisions of the U.S. Government National Standards Strategy for Critical and Emerging Technology. The CHIPS R&D Program Standards Summit was held as the first of the CHIPS R&D standards activities. The Summit brought together private sector thought leaders, who provided insights for the semiconductor sector covering strategic standards priorities, innovation in standards development, education and workforce needs, and linking standards and research.
Natcast Workforce Partner Alliance Program Funding Opportunity
On Monday, July 1, Natcast released the first workforce funding opportunity for the National Semiconductor Technology Center (NSTC). The NSTC Workforce Partner Alliance (WFPA) program will invest in initiatives addressing critical U.S. job and skill gaps across semiconductor design, manufacturing, and production. This initial workforce program plans to make awards to 4-10 high-impact projects. Project proposals should be one (1) to two (2) years in duration with a total budget between $500,000 and $2 million per award. Applications are due on July 26, 2024—ONE WEEK FROM TODAY.
The Department of Commerce expects to invest hundreds of millions of dollars in the NSTC’s workforce efforts, including the creation of a Workforce Center of Excellence.
ICYMI: Webinar: CHIPS for America: Research & Development (R&D) Facilities Model & Process
On July 12, the Department of Commerce and Natcast, the operator of the NSTC, announced the processes for selecting the first three R&D facilities. This webinar is an informational video explaining the facilities model and section process.
Biden-Harris Administration to Invest Up to $1.6 Billion to Establish and Accelerate Domestic Capacity Advanced Packaging
On July 9, as part of President Biden’s Investing in America agenda, the U.S. Department of Commerce issued a Notice of Intent (NOI) to open a competition for new research and development (R&D) activities that will establish and accelerate domestic capacity for semiconductor advanced packaging. The CHIPS for America program anticipates up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP).
A webinar on this Notice of Intent here.
NSTC CALL FOR PROPOSALS: Artificial Intelligence Driven RF Integrated Circuit Design Enablement (AIDRFIC)
On June 28, 2024, Natcast released the first call for proposals for the NSTC’s initial research and development (R&D) programs. This first NSTC R&D program will address the domestic RF IC (Radio Frequency Integrated Circuit) industry and is focused on the adaptation of Artificial Intelligence (AI) and Machine Learning (ML) technology for use in RF design. Its objective is the successful demonstration of AI-based tools used to improve design productivity for RFICs thus lowering the risk of further investment in commercialization of the technology. Natcast anticipates awarding funding up to $30 million across multiple projects. Applicants must submit an executive summary by July 25, 2024, by 5 PM EDT.
A webinar on AIDRFIC was held on June 21, 2024. You can watch the recording here.
About CHIPS for America
CHIPS for America is part of President Biden’s economic plan to invest in America, stimulate private sector investment, create good-paying jobs, make more in the United States, and revitalize communities left behind. CHIPS for America includes the CHIPS Program Office, responsible for manufacturing incentives, and the CHIPS Research and Development (R&D) Office, responsible for R&D programs. Both offices sit within the National Institute of Standards and Technology (NIST) at the Department of Commerce. NIST promotes U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that enhance economic security and improve our quality of life. NIST is uniquely positioned to successfully administer the CHIPS for America program because of the bureau’s strong relationships with U.S. industries, its deep understanding of the semiconductor ecosystem, and its reputation as fair and trusted. Visit https://www.chips.gov to learn more.
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